Finetech

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Chip Defect Inspection System Vi-4303/4203 FX·HX

Vi-4303FX

Significant improvement on throughput from previous model.

  • X2 ~ X4 higher throughput
  • Recipe navigation wizard
  • 40% saving for floor space (Vi-4303)
  • For FOUP/ Open Cassette/ Tape Frame
<Main specifications>
Vi-4303FX Vi-4303HX Vi-4203FX Vi-4203HX
Handling Full Auto
Objective Lens Standard: 5×
Option: 1.25×, 2.5×, 10×, 20×, 50×
Pixel Resolution 0.60um∼
Inspection Time* 4× 2× 4× 2×
Wafer Size 300mm FOUP
200mm SMIF/Open Cassette		 100/ 125/ 150/ 200mm Open Cassette
Dicing Frame Size Frame for 200mm/300mm wafer Frame for 100/125/150/200mm

* Compare to Vi-4302/4202

Chip Defect Inspection System Vi-4302/4202/2202/1202

Vi-4202

Surface Defect Inspection for IC chips/CIS/MEMS/LED.

  • Unique inspection algorithm and optics design for high performance
  • Accurate and Stable Inspection for Diced or Expanded wafer
  • A series of machine models designed to meet the needs of production. Full-auto Vi-4302/4202, Affordable full-auto Vi-2202, Semi-auto Vi-1202
<Main specifications>
Vi-4302 Vi-4202 Vi-2202 Vi-1202
Handling Full Auto Manual
Objective Lens Standard: 5×
Option: 1.25×, 2.5×, 10×, 20×, 50×
Pixel Resolution 0.60um∼
Wafer Size 300mm FOUP
200mm SMIF		 100/ 125/ 150/ 200mm
(Option: 75mm)		 50/ 75/ 100/ 125/ 150/ 200mm
Dicing Frame Size — Frame for 100/ 125/ 150/ 200mm Frame for 100/125/150mm

In-Tray Chip Defect Inspection System Vi-3200

Vi-3200

Non-contact inspection for a single die in a tray pocket.

  • For very final defect inspection before shipping
  • Reject No-good dies
  • Best-in-class throughput
<Main Specifications>
Handling Full Auto
Objective Lens Standard: 2.5×
Option: 1.25×, 2.5×, 10×, 20×, 50×
Pixel Resolution 1.60um~
Tray Size 2/3/4 inch

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